App.:Digital Electronics
Thickness:0.9mm
Surface treatment:ENIG+OSP
Material:FR4 IT-170GRAI
Layer:10L ELIC(4+2+4)
App.:LED HDI
Typical technical specification:
Thickness:2.0mm
Surface treatment:ENIG
Material:FR4 TG150
Layer:8L HDI(2+2+2)
Min. Technical Holes:None(Only design laser drill and depth control drill)